Simulation is more than Software

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The printed circuit boards (PCBs) must be powerful and well-designed to provide quality solutions for power integrity and signal integrity. Additionally, all connectors and electrical and optical cables connected to the PCB must provide a reliable environment for high-speed digital signals. To keep pace with big data and the Internet of Things, PCB/chip speed and reliability are paramount. To meet aggressive specifications, engineering teams need accurate simulations to validate and improve designs before they are taped out — and well before prototyping.

Conventional workflows don’t work in the high di/dt design because they are obtuse to the spike voltages induced across layout parasitics; V_spike = L_parasitic * di/dt.

Ansys EM solver for modeling is best as it is very accurate & reliable.

Agenda

  • Introduction to Computational Electromagnetics (CEM)
  • SI, PI & EMC in High di/dt Design
  • SI, PI & EMC best Simulation Practices
  • Electrical Induced Thermal Fatigue Analysis: Joule Heating.
  • Summary

Target Group

  • CXO, HOD Executives from Design and Engineering units.
  • Technologists from R&D, Verification and manufacturing teams.
  • Simulation Engineers (EM, Antenna, PCB, RF and EMC Certification).
  • Design Engineers (PCB, Electronics Component, RF and Antenna).
  • Research Scholars working on New Product Development.
  • Users, Decision-makers, General enthusiasts.

Benefits

Get an insight on how to address Power integrity, Signal integrity, Thermal Integrity and EMC challenges in high di/dt design using simulations and practice these competencies in a risk-free environment and manage to have high knowledge retention.