Simulations and additive manufacturing for new applications in electronics

This Techday is organised by CADFEM and iPrint. iPrint is an institute and competence center of the HEIA-FR and one of the most dynamic institutions for applied research in the field of digital printing.

Flexible additive manufacturing processes play a key role in substrate manufacturing and connection technology. The integration of the circuits into three-dimensional surfaces often eliminates the need to use an additional substrate. Also, it leads the way towards innovative branding or personalized products. Devices for medical, aerospace and IoT applications can be significantly reduced in size by using these new printing technologies.

In addition to the simulation tools presented by CADFEM for advanced electronic applications, iPrint will make an exception and open its laboratory.