Details

In an increasingly interconnected world, it is no longer sufficient if just the mechanic parts are reliable. Electronic components are necessary to enable desired functions. Sensors and actuators, together with the appropriate software, give us a flexibility that allows us to react quickly to new requirements. This increases the complexity and there are further sources of error that we must consider. For example, in addition to the mechanics, the electronic parts must also function reliably.

Benefits

Thermal cycles and mechanical vibrations can damage solder joints and thus lead to premature failure of our electronics. Therefore, we also want to examine these at an early stage and test out appropriate countermeasures if problems occur, ideally even before test the first prototype. In this presentation, we will look at procedures for a structural-mechanical examination of a solder joint, with the aim of ensuring a certain life cycle.

Target Group

• Users 
• Decision maker 
• Generally interested 
• Designers 

Agenda

• Insight into the procedures for a structural-mechanical examination of a solder joint 
• Consideration of complex interrelationships (mechanics and electronic components) and resulting further sources of error