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Ansys Icepak

Thermal Simulation of Electrotechnical Products

Ansys
Heat Transfer
Heat Transfer
Fluid mechanics

Understand heat generation in electrotechnical components and facilitate proper heat transfer

When the temperature of your electronic products is key, the solution is ANSYS Icepak. Designed as a complete Conjugate Heat Transfer (CHT) solution with a CFD solver based on the ANSYS Fluent Solver, you can carry out simultaneous analyses of both the heat generation of the ...

More details of the software license

Overview
License Type
Paid-Up incl. TECS , Annual Lease, On-Demand
Delivery
Software Download
License Key
Delivery approx. 1-2 days after signing the contract
License Type
Paid-Up incl. TECS , Annual Lease, On-Demand
Delivery
Software Download
License Key
Delivery approx. 1-2 days after signing the contract

Details about the software products

When the temperature of your electronic products is key, the solution is ANSYS Icepak. Designed as a complete Conjugate Heat Transfer (CHT) solution with a CFD solver based on the ANSYS Fluent Solver, you can carry out simultaneous analyses of both the heat generation of the electronic component and the heat transfer of the surrounding fluid. Embedded in the ANSYS Electronics Desktop, it offers seamless integration of thermal tasks into the development workflow of electrotechnical products. From the individual IC Package and PCBs to housing structures, you can analyze and solve heat transfer and thermal management issues with extreme detail, even with limited expert knowledge.

Together with HPC, parameterization and modern optimization methods, effective support for the development of electrotechnical products is guaranteed.

Areas of application:

  • Heat dissipation of electronic structures
  • Heat generation in packages, PCBs, enclosures, and electrotechnical products of all kinds
  • Analysis of the interaction between current flow and heat generation
  • Switching behavior and dielectric strength of circuit breakers
  • Magnetic coupling systems

 

Service features:

  • Integration into the ANSYS Electronics Desktop
  • Conjugate Heat Transfer (CHT) solver based on ANSYS Fluent solution technology for mapping laminar and turbulent flow scenarios
  • Consideration of all relevant heat transfer mechanisms – conduction, convection, and radiation
  • Comprehensive libraries for mapping standard components such as fans, heatsinks, cooling media (incl. extensive materials database for solids)
  • Direct coupling to ANSYS Maxwell, ANSYS HFSS, ANSYS Q3D, and ANSYS SIwave for coupled electrical-thermal analysis
  • Import of ECAD PCB layout information and MCAD geometries
  • Derivation of reduced models for integration into the system simulation, e.g., for ANSYS Twin Builder

ANSYS Icepak

Detailed analysis of thermal management of electronic products; integrated in the ANSYS Electronics Desktop or use as a standalone application

 

ANSYS Icepak Solver

ANSYS Icepak as a pure solver license

 

ANSYS Electronics Desktop

The integrated user environment for model construction and electromagnetic simulations

 

ANSYS Optimetrics

Sensitivity analyses and numeric optimization

 

ANSYS Distributed Solve (DSO)

Simultaneous solving of multiple analyses for efficient, additional knowledge acquisition in a shorter time

Need more information about the product?

Here you will find information on product highlights and CADFEM expertise for an ideal implementation of simulation-based product development.