Tutorial No. 19 - Thermal management

How to deal with the thermal management of electrical and electronic devices using Ansys Icepak.

In this presentation we look at how to deal with the thermal management of electrical and electronic devices using ANSYS Icepak. Our starting point is a variable-frequency drive power transistor – and we have chosen to look at fluid flow and thermal conduction for this purpose. Simulation objects are compiled – based around a modular system, so as to facilitate an efficient simulation process. We also carry out model variant studies in order to investigate various heat sinks and cooling fans, and their impact on temperature.

Agenda:

Thermal Management using Ansys Icepak

• Application: IGBT cooling in a frequency converter
• Fluid flow and thermal conduction
• Building-block-based simulation objects
• Model variant studies using different heat sinks and fans

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