Simulation is more than Software

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Electronic components: Simulation for the ideal cooling concept

Learn how to use simulation to optimize the cooling of electronic assemblies for maximum reliability.

On Demand


Ensuring the reliability and cooling of electronic assemblies and devices is an important aspect of modern electronic product development. For optimal thermal management, all physical phenomena contributing to cooling are crucial: thermal conduction, radiation and convection. Each of these aspects can be taken into account with fluid mechanics simulation.

In this webinar, we will show typical examples of workflows and applications from power electronics.


We will give you an overview of the simulation options for cooling electrical devices. Using typical tasks, you will be shown how to make their development more efficient and sustainable.

Target Group

This webinar is intended for engineers and decision makers seeking simulation solutions to address thermal issues in electronic systems and their components.


  • Welcome - Frank Weiand, CADFEM GmbH
  • "Thermal simulation and optimization of passively cooled LED drivers" - Tobias Klein, Tridonic GmbH & Co. KG
  • "Overall thermal management of the PrintJet Connect printing system" - Alexander Meyer, Weidmüller Interface GmbH & Co. KG
  • "Design and check cooling concepts in the blink of an eye" - Sigrid Lang, CADFEM GmbH
  • Q&A


The language of the Webinar is German.

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