Whether airflow, cooling, or design, Ansys Icepak allows you to validate and optimize your electric products as early as the concept phase.
Electronic and thermal management from the concept to validation
Ansys Icepak provides realistic simulations for electronics heat dissipation from the power supply to the sensor area. Benefit from comprehensive results visualization, the flexible interfaces to electrical and mechanical simulation, and detailed modeling options.
- Thermal analysis of PCBs and IC packages
- Libraries for electronic components
- Comprehensive results visualization
- Interfaces for electrical and mechanical simulation
- Detailed and compact modeling
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Seminars relating to Ansys Icepak
Take part in CADFEM seminars on the topic of Ansys Icepak and learn how cooling processes can be simulated in electronics development and how these solution concepts can be applied to your own tasks.
The right solutions for your simulation projects
Simulation is everywhere and affects every industry. Since simulation requires more than software, CADFEM offers everything you need for successful simulation from a single source: software and IT solutions, consulting, support, engineering and knowledge sharing – always on the cutting edge.