Simulation is more than Software

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RF System-in-Package chip for Bluetooth and Ultra-wide-band

Development of RF System-in-Package chip for Bluetooth and Ultra-wide-band

Sector: Electrical engineering/electronicsSpecialist field: Electromagnetics

The proximity and number of components in a SIP and the tight manufacturing time of prototypes require a design methodology that gives first-time-right products. This methodology is based on the RF simulation of the entire product and makes extensive use of the HFSS tool. This case study shows an example of a recently developed module that contains a BLE radio, a UWB radio and 2 antennas.

Summary

Task

Once the first design of the module has been created in Altium, the substrate is analyzed with HFSS in combination with the SMD components to fine-tune the matching and rejection performance before the first manufacturing run.

Solution

The rejection at higher frequencies for the H3 certification is very important. This allows a very rapid workflow and getting the best of both worlds, field and circuit simulators.

Customer benefits

The development of such highly integrated modules is impossible without simulations. Not any simulations but very accurate and reliable simulations that lead to first-time-right products.

Project Details

Task

Once the first design of the module has been created in Altium, the substrate is analyzed with HFSS in combination with the SMD components to fine-tune the matching and rejection performance before the first manufacturing run. At the same time, the antenna system is studied and developed by simulation.

Once the first prototypes have been measured, HFSS is used to recorrect any performance deviations.

Finally, simulation is also used during the placement of the module in the complete system to determine the best position for the antennas to function properly.


Customer Benefit

The development of such highly integrated modules is impossible without simulations. Not any simulations but very accurate and reliable simulations that lead to first-time-right products. That saves time, money and effort of the RF engineers who can then invest the saved time on other products. In the RF field, engineers are the rarest resource. Being able to offer SiP before any other competitor is a market differentiator that gave Insight a huge leap forward. Insight trusts HFSS and the workflow that was codeveloped with CADFEM.


Solution

First the ECAD layout is created in Altium then transferred to discovery (previously known as spaceclaim) for defeaturing and cut-out extraction. Alternatively, the altium-ansys codesigner could be used. Using the circuit designer utility of HFSS, the antenna is matched at 2.4 GHz. Also, the rejection at higher frequencies for the H3 certification is very important. This allows a very rapid workflow and getting the best of both worlds, field and circuit simulators.

Cover Image: © INSIGHT SIP


HF Electromagnetics Product Manager

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