Every few years, a new electronic invention changes our lives and these devices, services rely on powerful data & more.
Details
The printed circuit boards (PCBs) must be powerful and well-designed to provide quality solutions for power integrity and signal integrity. Additionally, all connectors and electrical and optical cables connected to the PCB must provide a reliable environment for high-speed digital signals. To keep pace with big data and the Internet of Things, PCB/chip speed and reliability are paramount. To meet aggressive specifications, engineering teams need accurate simulations to validate and improve designs before they are taped out — and well before prototyping.
Conventional workflows don’t work in the high di/dt design because they are obtuse to the spike voltages induced across layout parasitics; V_spike = L_parasitic * di/dt.
Ansys EM solver for modeling is best as it is very accurate & reliable.
Agenda
- Introduction to Computational Electromagnetics (CEM)
- SI, PI & EMC in High di/dt Design
- SI, PI & EMC best Simulation Practices
- Electrical Induced Thermal Fatigue Analysis: Joule Heating.
- Summary
Target Group
- CXO, HOD Executives from Design and Engineering units.
- Technologists from R&D, Verification and manufacturing teams.
- Simulation Engineers (EM, Antenna, PCB, RF and EMC Certification).
- Design Engineers (PCB, Electronics Component, RF and Antenna).
- Research Scholars working on New Product Development.
- Users, Decision-makers, General enthusiasts.
Benefits
Get an insight on how to address Power integrity, Signal integrity, Thermal Integrity and EMC challenges in high di/dt design using simulations and practice these competencies in a risk-free environment and manage to have high knowledge retention.