Using Simulation to develop reliable printed circuit boards
Details
Faster signals, higher performance, and smaller dimensions present ever new challenges for the development of electronic components. We show how numerical simulation can be used to check the transmission quality of the data channels in terms of signal integrity and analyze the optimal voltage supply of the components in terms of power integrity. In addition, thermal simulation indicates where temperature hotspots can occur in the design.
Agenda
Power integrity: ensure the power supply of all components
Signal integrity: analyze and optimize data channels
Thermal reliability: identify and eliminate temperature hotspots in the design
Lecturer
Frank Weiand
Business Development, CADFEM Germany GmbH, Stuttgart
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