Details

Advancements in electronic application has led to high power density & relatively compact electronic design units. With latest compact electronic design units, maintaining effective cooling is a challenging task for engineers. Using accurate & robust CHT simulations for electronic applications, engineers can highlight the various opportunities to optimize the heat transfer across the compact electronic units.

From individual integrated circuits to packages and printed circuit boards, up to computer housings and entire data centers, the thermal performance can be predicted through simulation with Ansys Icepak. Ansys Icepak can be used to perform conduction, convection and radiation conjugate heat transfer analyses specifically catered for the electronics industry, from chip-level to system-level simulation. Vast libraries in Ansys Icepak include data for materials, heat sinks, thermal interface materials, filters, packages, and manufacturers’ fan and blower data.

Agenda

• Introduction to Ansys Icepak Key features
• Predicting Thermal Performance with Ansys Icepak
• Electronics Assembly Cooling Application
• Complete Multi-Physics Solutions by Ansys

Target Group

• R&D Engineers
• Design Engineers
• Product Engineers.
• Testing Engineers

Benefits

• Learn how simulation helps to validate designs
• Gain an overview of CFD
• Insight into performing electronics cooling simulations.
• Understand Ansys and CADFEM solutions